Panasonic commercialises encapsulation material
OSAKA, Japan, March 23, 2016
Panasonic Corporation, a leader in the development of diverse electronics technologies and solutions, has commercialised an encapsulation material having a high dielectric constant that is suitable for finger-print recognition sensor packages to be incorporated in mobile devices.
It will start full-scale mass production of the product in April, said a statement.
This material will help improve the performance as well as reduce the size and thickness of packages for finger-print recognition sensors, it said.
Finger-print recognition features are expected to be embedded in an increasing number of mobile devices including smartphones.
Sapphire glass has been used in the finger-print contact part of packages for existing capacitive finger-print recognition sensors due to its high dielectric constant, but has drawbacks such as the difficulty of making the sensor packages smaller and thinner and the complexity of the manufacturing processes.
The encapsulation material's advantages include high relative permittivity; narrow-part filling and low warpage during molding; and ready for packaging thinner structures with simplified manufacturing processes. - TradeArabia News Service
